Ukuba iibhola ze-solder zivela, zinokuchaphazela ukusebenza ngokubanzi kweseketheibhodi.Iibhola ezincinci ze-solder azibukeki kwaye zinokususa izinto ngaphandle kophawu.Kwiimeko ezimbi kakhulu, iibhola ezinkulu ze-solder zingawa phantsi kwaye zinciphise umgangatho wamacandelo amacandelo.Okubi nangakumbi, ezinye iibhola zinokuqengqelekakwezinye iindawo zebhodi, ezikhokelela kwiibhulukhwe ezimfutshane kunye nokutshisa.
Izizathu ezimbalwa zokuba iibhola ze-solder zenzeke ziquka:
Eukufuma okugqithisileyo kwindawo yokwakha
Ubumanzi okanye ukufuma kwi-PCB
Ukuguquguquka okuninzi kwi-solder paste
Ubushushu okanye uxinzelelo luphezulu kakhulu ngexesha lenkqubo yokubuyisela kwakhona
Ukungosulwa ngokwaneleyo kunye nokucoca emva kokuhamba kwakhona
I-solder paste ayilungiswanga ngokwaneleyo
Iindlela zokuthintela iibhola zeSolder
Ngezizathu zeebhola ze-solder engqondweni, unokusebenzisa iindlela ezahlukeneyo kunye nemilinganiselo ngexesha lokuvelisa ukuthintela.Amanye amanyathelo asebenzayo ngala:
1. Nciphisa PCB Ukufuma
Izinto ezisisiseko zePCB zinokugcina ukufuma nje ukuba uzibeke kwimveliso.Ukuba ibhodi imanzi xa uqala ukusebenzisa i-solder, iibhola ze-solder ziya kwenzeka.Ngokuqinisekisa ukuba ibhodi ikhululekile ukufuma njengokokunokwenzeka, umenzi unokukuthintela ukuba zingenzeki.
Gcina zonke iiPCB kwindawo eyomileyo, ngaphandle kwemithombo ekufutshane yokufuma.Phambi kwemveliso, jonga ibhodi nganye ngeempawu zokufuma, kwaye uyomise ngamalaphu achasene ne-static.Khumbula ukuba ukufuma kunokudibanisa kwiiphedi zesolder.Ukubhaka iibhodi kwi-120 degrees celsius iiyure ezine phambi kokuba umjikelo ngamnye wemveliso ukhuphe nakuphi na ukufuma okugqithisileyo.
2. Khetha iNcama yeSolder echanekileyo
Izinto ezisetyenziselwa ukwenza i-solder zinokuvelisa iibhola ze-solder.Umxholo wesinyithi ophezulu kunye ne-oxidation ephantsi ngaphakathi kwe-paste kunciphisa amathuba okuba iibhola zenziwe, njengoko i-viscosity ye-solder iyayinqanda.ekuweni xa eshushu.
Unokusebenzisa i-flux ukunceda ukuthintela i-oxidation kunye nokunciphisa ukucocwa kweebhodi emva kwe-soldering, kodwa kakhulu kuya kukhokelela ekuweni kwesakhiwo.Khetha i-solder paste ehlangabezana nemigaqo efunekayo yokwenza ibhodi, kwaye amathuba okwenza iibhola ze-solder ziya kuhla kakhulu.
3. Ukutshisa iPCB kwangaphambili
Njengoko inkqubo yokubuyisela iqala, ubushushu obuphezulu bunokubangela ukunyibilika kwangaphambi kwexesha kunye nokuphuma komphungayesolder ngendlela yokuba ibangele ukuba iqame kunye nebhola.Oku kubangela umahluko omkhulu phakathi kwezinto zebhodi kunye ne-oven.
Ukuthintela oku, shushumbisa iibhodi ukuze zisondele kubushushu be-oven.Oku kuya kunciphisa iqondo lotshintsho xa ukufudumeza kuqala ngaphakathi, kuvumela i-solder ukuba inyibilike ngokulinganayo ngaphandle kokutshisa.
4. Ungaphoswa yiMask yeSolder
Iimaski ze-Solder ngumaleko obhityileyo wepolymer esetyenziswa kwimikhondo yobhedu yesekethe, kwaye iibhola ze-solder zinokubumba ngaphandle kwazo.Qinisekisa ukuba usebenzisa ngokufanelekileyo i-solder paste ukukhusela izithuba phakathi kweetrayisi kunye neepads, kwaye khangela ukuba imaski ye-solder ikhona.
Ungayiphucula le nkqubo ngokusebenzisa izixhobo ezikumgangatho ophezulu kwaye nangokucotha isantya apho iibhodi zifudunyezwa.Izinga lokutshisa okucothayo livumela i-solder ukuba isasazeke ngokulinganayo ngaphandle kokushiya izithuba zeebhola.
5. Nciphisa PCB Mounting Uxinzelelo
Uxinzelelo olubekwe ebhodini xa ixhonyiwe lunokolula okanye lucuthe umkhondo kunye neepads.Uxinzelelo oluninzi lwangaphakathi kwaye iipads ziya kutyhala zivaliwe;Uxinzelelo olukhulu lwangaphandle kwaye baya kutsalwa bavuleke.
Xa zivuleke kakhulu, i-solder iya kukhutshelwa ngaphandle, kwaye ayiyi kuba yanele kuzo xa ivaliwe.Qinisekisa ukuba ibhodi ayolulwa okanye ityunyuzwe phambi kokuveliswa, kwaye eli nani lingalunganga le-solder aliyi kukhula.
6. Khangela kabini iSithuba sePad
Ukuba iipads ebhodini zikwiindawo ezingalunganga okanye zisondele kakhulu okanye zikude kakhulu, oku kunokukhokelela ekudibaniseni i-solder engalunganga.Ukuba iibhola ze-solder zenza ifom xa iipads zibekwe ngokungalunganga, oku kwandisa ithuba lokuba ziya kuphuma kwaye zibangele iifutshane.
Qinisekisa ukuba zonke iiplani zineepads ezisetwe kwezona zikhundla ziphezulu kwaye ibhodi nganye iprintwe ngokuchanekileyo.Logama nje belungile ukungena, akufuneki kubekho miba xa bephuma.
7. Gcina iliso kwi-Stencil Cleaning
Emva kokudlula nganye, kufuneka ucoce ngokufanelekileyo i-solder paste engaphezulu okanye uphume kwi-stencil.Ukuba awukugcini ukugqithisela kwisheke, ziya kudluliselwa kwiibhodi ezizayo ngexesha lenkqubo yokuvelisa.Oku kugqithiswa kuya kubhenk phezu komhlaba okanye iipads eziphuphumayo kwaye zenze iibhola.
Kulungile ukucoca i-oyile eninzi kunye ne-solder kwi-stencil emva komjikelo ngamnye ukukhusela i-buildups.Ngokuqinisekileyo, kunokutya ixesha, kodwa kungcono kakhulu ukuwuyeka umcimbi ngaphambi kokuba ube mandundu.
Iibhola ze-Solder ziyi-bane yayo nayiphi na intambo yomenzi wendibano ye-EMS.Iingxaki zabo zilula, kodwa oonobangela babo baninzi kakhulu.Ngethamsanqa, inqanaba ngalinye lenkqubo yokuvelisa libonelela ngendlela entsha yokuthintela ukuba zingenzeki.
Phonononga inkqubo yakho yemveliso kwaye ubone apho ungafaka khona la manyathelo angasentla ukuthintelaukudalwa kweebhola ze-solder kwi-SMT yokuvelisa.
Ixesha lokuposa: Mar-29-2023