ILaser Ball Jetting Machine ngumatshini wokwenza i-laser soldering ezenzekelayo, ukubonelela ngezixhobo ezahlukeneyo ze-microelectronic, ezinikezelwe ngokukodwa kwiimodyuli zekhamera, izinzwa, izithethi ze-TWS kunye nezixhobo zokukhanya.
Inkqubo iyakwazi ukubeka kwaye iphinde ikhuphe iibhola ze-solder ezinobubanzi phakathi kwe-300 µm kunye ne-2000 µm, isantya sokuthengisa simalunga ne-3 ~ 5 iibhola ngesekhondi.
Isebenza kwi-soldering yebhola yeemveliso ezinjengeeModyuli zeKhamera, ukubhola kwakhona kwe-BGA, ii-wafers, iimveliso ze-optoelectronic, izinzwa, izithethi ze-TWS, i-FPC ukuya kwi-PC eqinile ... njl.